Open Hardware
Open Compute Project
Our team members have been involved in the Open Compute Project (OCP) for over ten years. This global collaboration for open hardware innovation has served as a powerful catalyst for developing, promoting, and innovating in the hyperscale ecosystem. Companies large and small, vendors, service providers, and end users are able to collaborate on new hardware and hardware-adjacent projects across a wide spectrum of technologies and topics - from servers to racks to cooling to AI chips and networking. These power collaborations enable the entire inudstry to advance more quickly than if we all just worked separately.
Sesame by ITRenew
Our team - alongside many others - was responsible for the design, production, and deployment of rack-level solutions in the Sesame portfolio from ITRenew. These systems use recertified OCP hardware to create powerful hyperscale systems accessible to enterprises large and small, with 50% and greater TCO savings without any compromise in performance or scalability. Thousands of systems are deployed today with customers worldwide, running a range of demanding compute and storage workloads.
Edge Computing
In an effort to bring hyperscale technology outside of the data center, our team has innovated with over a dozen parners, including a key collaboration with Polyrack to bring open compute technology to edge environments of various sizes and use cases.
The OCP Discovery chassis, for example, houses four two-socket OCP servers, fits under a desk, and is powered by standard outlet power - 110V or 220V - no data center, advanced cooling, or 3-phase outlets required. With an integrated management switch and an external 100G data switch, the cluster operates exactly as the hardware in a full data center rack would, allowing evaluation, benchmarking, and small footprint deployments at scale.
A customer's 1,000 server cloud fleet might consist of twenty-five data center racks with 40 servers each in five traditional locations, or two hundred and fifty Discovery enclosures with 4 servers each in one hundred edge locations. A wide range of form factors and environmentals can be supported with modest changes in enclosure design - computing and networking components are interchangeable thanks to open standards.